期刊文献+

pH值和浓度对CeO_2抛光液性能影响的研究 被引量:7

The Effect of pH Value and Solid Concentration on the Properties of Cerium Oxide Slurry
下载PDF
导出
摘要 研究了氧化铈抛光液颗粒浓度和pH值的变化对抛光液悬浮性能、接触角和粘度的影响。结果表明:随着浓度和pH值的变化,氧化铈抛光液悬浮性能、接触角和粘度均出现变化。随着原始抛光液被逐渐稀释,抛光液的悬浮性能下降,接触角和粘度也减小,然而pH值的变化对它们的影响则较为复杂。 The effect of pH value and solid concentration on the properties of cerium oxide slurry was studied,such as stability,contact angle on Si (100) surface and viscosity number.The experimental results show,with reducing the solid concentration of the original slurry,the stability of the slurry becomes worse and the contact angle and viscosity number decreases.However,the influence of pH value on these properties of slurry appears more complex.
出处 《润滑与密封》 CAS CSCD 北大核心 2005年第4期9-11,共3页 Lubrication Engineering
基金 国家自然科学基金重大资助项目(50390060).
关键词 氧化铈抛光液 颗粒浓度 PH值 稳定性 cerium oxide slurry solid concentration pH value stability
  • 相关文献

参考文献2

二级参考文献19

  • 1Chiu J B, Yu C C, Shen S H. Application of soft landing to the process control of chemical mechanical polishing[J]. Microelectronic Engineering, 2003, 65(3): 345-356.
  • 2Bifao T G, Bow T A, Scattergood R, et al.Ductile-regime grinding: a new technology for machining brittle material[J].Journal of Engineering Industry,1991, 113: 184-189.
  • 3Seok J W, Sukam C P, Kim A T.Multiscale material removal modeling of chemical mechanical polishing[J].Wear,2003, 254 (2-3): 307-320.
  • 4HOSHINO T,KURATA Y,TERASAKI Y,et al.Mechanism of polishing of SiO2 films by CeO2 particles[].Journal of Non- Crystalline Solids.2001
  • 5BORST C L,GILL W N,GUTMANN R J.Chemical-me-chanical polishing of lowdielectric constant polymers and or-ganosilicate glasses:fundamental mechanisms and applicationto IC interconnect technology[]..2002
  • 6Kaufman F B,Thompson D B,Broabie R E,et al.Chemical -mechanical polishing for fabricating patterned W metal features as chip interconnects[].Journal of the Electrochemical Society.1991
  • 7J.M.Steigerwald,S.P.Murarka,J.Ho,R.J.Gutmann,D.J.Duquette. Journal of Vacuum Science and Technology . 1995
  • 8Preston F.The theory and design of plate glass polishing machines[].J Soc Glass Technol.1927
  • 9Liu C,Dai B,Tseng W,et al.Modeling of the wear mechanism during chemical -mechanical polishing[].J of the Electrochemical Society.1996
  • 10Luo J F,D orn feld D A.M ateria l rem ova lm echan ism in chem i-ca l m echan ica l po lish ing:theory and m odeling[].IEEET ransaction on Sem iconductor M anu facturing.2001

共引文献46

同被引文献52

引证文献7

二级引证文献24

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部