摘要
阐述了薄膜残余应力对MEMS器件结构的影响及其产生根源、测量技术与控制技术,对多层薄膜结构中热应力的产生进行了有限元建模和理论分析。通过对一种残余应力测量结构(微旋转结构)的仿真分析表明,旋转梁端的偏移量与残余应变成线性对应关系。最后,简单介绍了沉积工艺条件、应变相消法以及快速热退火在薄膜残余应力控制中的应用。
Residual stresses of thin films have large effects on MEMS structures. It is introduced in this paper how they are generated, measured and controlled in MEMS designing and manufacturing. Particularly, thermal stresses in multi-layer MEMS structures are modeled with FEM and analyzed. To measure residual stresses, a new microstructure (micro-rotating-structure) is simulated and the results reveal simple relation of linearity between offset of the rotating beam tip and residual strain in MEMS thin films. Due to its many advantages, micro-rotating-structure is proved to be efficient for measuring residual stresses. In the end, three methods to control residual stresses in MEMS thin films are briefly introduced: film deposition processing, strain counteraction and rapid thermal annealing.
出处
《微细加工技术》
EI
2005年第2期46-50,共5页
Microfabrication Technology
关键词
微机电系统
薄膜残余应力
微旋转结构
应变相消
快速热退火
<Keyword>MEMS
residual stresses of thin films
micro-rotating-structures
strain counteraction
rapid thermal annealing
