摘要
研究了界面动力学因素对平界面稳定性的影响．在界面局部生长速率是界面过冷度和界面动力学的函数条件下，获得了扰动增长速率的显式表达式，结果表明，界面动力学因素对平界面具有稳定作用。
The anistropy of interface kinetics is one of the important characteristic of the solid / liquid interface which plays a very important role on the interface stability and momhological evolution during solidification. Up to now no nature model has been established on the anistropy of interface kinetics. Simulating interface kinetics anistropy by A(θ) = εcos4θ and based on the assumption that the local growth rate is the function of interface undercooling and interface kinetics, a linear stability analysis has been made in the present paper by using Coriell and Sekerka's and Young's for reference. An obvious solution is obtained for the growth rate of interface disturbance and the effect of interface energy and interface kinetics on the stability of planar interface. The differences and relationships between the present results and the theoris of constitution undercooling and Mullins and Sekerka's are also discussed. It is concluded that interface energy and interface kinetics are beneficial to the stabilization of planar interface.
出处
《材料研究学报》
EI
CAS
CSCD
1995年第1期7-12,共6页
Chinese Journal of Materials Research
关键词
界面稳定性
界面动力学
定向凝固
planar interface stability
interface kinetics
directional solidification
