摘要
根据镀液中待测组份或杂质的电化学特性和添加剂对金属电沉积过程的阻化或活化效应，建立了测定某些镀液组份、一些杂质和常用添加剂的浓度的直接伏安法、间接伏安法和金属沉积层阳极溶出伏安法。这些方法测定步骤简单、快速，适合于电镀生产监控和电镀工艺研究。
Based upon the electrochemical characteristics of the components or impurities tobe determined in the electroplating baths,and the inhibition or activation effect of the additives usedon the electrodepcosition processes of metals and alloys,direct voltammetry,indirect voltammetry andvoltammetry with anodic stripping of metallic deposits,were suggested to determine the concentrationof some components,several impurities and the additives usually used in the electroplating baths.Theprocedure of those methtods are simple and rapid,and are suitable to be used for in situ control inelectroplating workshops.
出处
《电化学》
CAS
CSCD
1995年第1期82-86,共5页
Journal of Electrochemistry
