摘要
采用有限差分法对集成电路的热特性进行数值分析与计算，对影响集成电路热特性的几个因素（如冷却条件、封装结构和功率分布等）进行了分析，为提高集成电路的热可靠性提供了依据．
Based on the Finite Differential Method, the thermal characteristies of ICs package arediscussed and analyzed,and several factors that influence the ICs package thermal characteris-ties,such as package structure,power distribution,and cooling conditions,are thoroughly an-dyzed,which can be a help to improve the ICs thermal reliability.
出处
《西安电子科技大学学报》
EI
CAS
CSCD
北大核心
1995年第4期380-385,共6页
Journal of Xidian University
关键词
集成电路
热特性分析
制造工艺
thermal characteristies
integrated circuit(IC)
finite differential method
