摘要
低熔玻璃广泛用作封接玻璃和电子浆料中的粘接相。现有低熔玻璃绝大部分为高铅含量玻璃。提出组成中不含 Pb、Hg、Cd、As、Tl、Cr 和放射性元素的玻璃称为组成无公害玻璃,综述了低熔玻璃的发展现状,指出电子产品目前所用含铅玻璃的取代物可能是磷酸盐、矾酸盐、铋酸盐玻璃。建立磷酸盐、矾酸盐、铋酸盐玻璃相关基础理论.发展玻璃形成新理论以及新的材料制备技术是组成无公害低熔玻璃研究与开发的重点。
Low melting glasses are used extensively as seal glass or solder glass and inorganic binder of electronic pastes. Most of the low melting glasses currently used are high lead contained. In this paper, glasses with composition free of Pb, Hg,Cd, As,Tl,Cr and radioactive elements are named as glasses free of pollution. Also, application and development of the low melting glass are reviewed. The phosphate-, vanadate- and bismuth-contained glasses are promising candidates for the lead glass currently used by electric equipment. To theorize the phosphate, vanadate and bismuth glasses, and to propose new glass forming theory, and to develop new glass fabrication processes will play an important role in the development of low melting glass.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2005年第8期40-42,54,共4页
Materials Reports
基金
北京市教委
北京印刷学院院人才引进基金
