摘要
高温环境下工作的封装有相变材料的热沉,一方面利用固液相变潜热存储系统吸收电子器件散发的热量,另一方面还要吸收从高温环境传递过来的热量。热沉结构的几何外形是影响上述两个热量传递的关键因素。以热沉总体尺寸、边界条件、热沉和相变材料为约束条件,热沉基部最高温度到达临界温度的最大时间为优化目标,通过数值模拟,获得了热沉翅片高度和宽度、热沉基部宽度和厚度的优化值,优化值兼顾了热沉传热效率和蓄热能力两个方面,并对优化过程中的热沉进行了传热分析。
Heat sink encapsulated with phase change material for high temperature environment absorbs heat from electronic devices and high temperature ambient, The geometry of heat sink has great influence on heat transfer. Optimization of the geometry of heat sink involves determination of the fin length, the fin thickness, the base width and the base thickness that maximizes the time before the base of heat sink reaches a critical temperature with the constraint conditions of whole size of heat sink, boundary conditions, fin material, and phase change material. The optimization values of the four parameter mentioned above, which give attention to two aspects both the efficiency of heat transfer and the capability of heat storage, are obtained through numerical simulation of heat transfer. The heat transfer is also analyzed in the process of optimization.
出处
《电子器件》
EI
CAS
2005年第3期466-469,共4页
Chinese Journal of Electron Devices
基金
中国博士后基金项目(2004035324)
关键词
高温
相变材料
热沉
优化
high temperature
phase change material
heat sink
optimization
