摘要
在芯片粘接前的布胶实验中不仅要实现如点、直线、圆、圆弧等基本图案和由基本图案组成的复杂图案胶液分配,而且还要通过速度匹配、增加返回过程等使其满足布胶精度要求,这使得布胶过程具有一定的特殊性。根据这种布胶过程的特殊性,介绍了由工控机控制胶液分配系统的软件控制系统。采用模块化、层次化设计方法来实现布胶系统的控制软件。
Before die bonding not only want to realize various kinds of basic pattern include dot, line, circle, arc etc, and complicated pattern constituted by basic pattern dispensing, but also confirm the speed and acceleration that match with the dispensing height automatically through the introduction of the height; Confirm the return distance in the straight line and arc dispensing automatically in order to improve the consistency of dispensing, etc. This cause the process of die bonding has some extraordinary. Because of this the paper will instruct the software control systems in die bonding experiment. It adopts the method of blocking and layering to design the systems.
出处
《电子工业专用设备》
2005年第9期18-21,共4页
Equipment for Electronic Products Manufacturing
关键词
胶液分配
控制系统
速度匹配
返回过程
Dispensing
Control Systems
Velocity Matching
Return Process
