摘要
将均匀化理论应用于具有非完全(单层内)周期性微结构的倒装焊底充胶电子封装元件,建立了高阶逐层离散层板模型,用解析法分析热载荷下结构的温度应力.计算结果与有限元解的比较表明,该分析模型和方法是有效的,而且比较简便.算例分析结果显示,胶层厚度、焊点密度、胶与焊点材料的模量比和体积比,对于焊点温度应力有明显影响.
In this paper homogenization theory was applied to flip-chip electronic packaging with underflU, in which periodic microstructures is not complete （single layer）. Higher order discrete-layer laminate model is developed for evaluating thermal stresses of packaging using analytical methods. The efficiency and simplicity of the present analytic model and method are compared with FEM solutions. The numerical results show that thermal stresses of solder joints are affected evidently by thickness of underfill, density of solder joints, material moduli and volume ratios between underfill and solders.
出处
《力学学报》
EI
CSCD
北大核心
2005年第4期428-434,共7页
Chinese Journal of Theoretical and Applied Mechanics
关键词
电子封装
均匀化理论
高阶逐层离散模型
多层板
温度应力
electronic packaging, homogenization theory, higher order discrete-layer model, laminate, thermal stress
