摘要
X射线检测技术是一种能对不可视部位进行检测的技术。本文利用X射线对3D—MCM中的BGA焊点、基板和隔板之间的焊料凸点、叠层基板间的垂直互连和陶瓷-金属封装等进行检测;对存在于焊点和凸点中的气孔、垂直互连中的开路和封装中的孔洞等进行了分析。
The method of X-ray Inspection is one that the unseen place can be inspected with the X-ray. The paper describes that the BGA solder joint, the solder bumps between 2D-MCM and spacer board, vertical interconnect between 2D-MCM layers and ceramic-metal package are inspected with X-ray. The voids in solder joints and bumps, opening on vertical interconnect and the voids and holes in ceramic-metal solder are analyzed.
出处
《电子与封装》
2005年第9期20-23,28,共5页
Electronics & Packaging
