摘要
针对石油化工等领域高温下压力测量的要求,设计了压阻式压力传感器硅芯片,采用SIMOX技术SOI晶片,在微加工平台上制作了硅芯片。对不同的用户工况设计了装配结构,采用耐高温封装工艺,研究了耐高温微型压力传感器封装材料匹配与热应力消除技术,解决了内外引线的技术难点。从低成本、易操作性出发,设计了温度系数补偿电路,研制了精度高、稳定性佳的耐高温通用压力传感器。
To meet the needs of pressure measurements in harsh environments such as high temperatures and aggressive media, a high temperature pressure sensor was prepared. The strain gauge chip of piezoresistive pressure sensor was designed and fabricated in the micro-machining workshop based on SIMOX technology. The TCE （thermal coefficient of expansion） mismatches among different materials within the high micro pressure sensor system were studied. The pressure sensor was fabricated successfully using high temperature packaging process. The TCS（temperature coefficient of sensitivity） and TCO （temperature coefficient of offset） compensation circuit was selected and easily done. The sensor is characterized with high accuracy and excellent reliability. This work demonstrates batch manufacture and operation of generic piezoresistive pressure sensor for high temperature.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2005年第20期1795-1798,共4页
China Mechanical Engineering
基金
国家863高技术研究发展计划资助项目(2002AA404470)
国家"九五"传感器技术攻关项目(96-748-02-01/07)
浙江省科技攻关计划资助项目(2005C31048)
关键词
高温压力传感器
SIMOX
耐高温封装
补偿电路
high temperature pressure sensor
SIMOX
high temperature packaging
compensation circuit
