摘要
本文提出一种改进型的管状小型化光纤光栅温度补偿封装技术,这种方法是基于双金属结构来实现无源温度补偿功能。与其他双金属结构相比,其优势在于可以实现封装结构的管状小型化,尺寸可小于Φ5mm×50mm(D×L)。在0℃-75℃范围内,该封装结构的光栅温度系数小于1pm/℃,完全达到实用化指标性能。
An improved temperature compensation packaging method based on twin metal structure is brought forward, which can make package size minimi/ing. Compare with traditional twin metal structurc, this method has the advantage of minitype （Size less than φ5mm× 5mm ） and high performance（ tempelature coefficient Jess than lpm/ C ）.
