摘要
利用单体配位插层法制备酚醛树脂/蒙脱土纳米复合材料,并对不同蒙脱土含量的复合材料在软化点、粘结剪切强度和热稳定性方面与纯酚醛树脂进行比较.结果表明:当蒙脱土质量分数为2 %～5 %时,复合材料的软化点变化不明显;不同蒙脱土含量的酚醛树脂/蒙脱土纳米复合材料的粘结剪切强度均高于纯酚醛树脂;在温度低于300 ℃和温度高于400 ℃时复合材料在热稳定性方面均优于纯酚醛树脂.
Phenolic resin/montmorillonite nanocomposites were prepared by monomer coordination and intercalative polymerization. Compared with pure phenolic resin, when content of montmorillonite was 2 % -5 %, there was not obvious change in the softening point of nanocomposites and adhesive intensity of nanocomposites was better, When the temperature was less than 300℃ or more than 400 ℃, nanocomposites were superior to phenolic resins in thermal stability.
出处
《沈阳化工学院学报》
2005年第3期164-166,179,共4页
Journal of Shenyang Institute of Chemical Technolgy
基金
辽宁省教育厅科学研究计划资助项目(20040285)
关键词
蒙脱土
酚醛树脂
配位插层
纳米复合材料
montmorillionite
phenolic resin
coordination intercalation
nanocomposite
