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无机熔盐镀铝层的制备与性能研究 被引量:13

Preparation and properties of aluminum coating electroplated by inorganic molten salts
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摘要 利用AlCl3-NaCl-KCl三元无机熔盐体系在Q235低碳钢基体上进行了镀铝试验,并就不同电镀工艺对铝镀层表面 形貌、厚度、结构、结合力及耐蚀性能等进行了研究。结果表明,AlCl3-NaCl-KCl无机熔盐体系镀铝层为银白色,并呈现均 匀、细小的针片状生长特征。铝镀层的厚度随电流密度和电镀时间的增加而增大;在低电流密度下,铝镀层主要由(200)面 结构组成;在高电流密度下,铝镀层易形成(111)面的结构。铝镀层与碳钢基体问的结合力随镀层厚度的增加而减少,但均 大于30 N。在3.5%NaCl的水溶液中,铝镀层具有较好的耐蚀性能。铝镀层的最佳工艺为电流密度3.3-4.0 A/dm2,电镀时间 45-90 min。 Aluminum electroplating on Q235 carbon steel from AlCl3-NaCl-KCl inorganic molten salt was carried out, and the surface morphology, thickness, structure, adhesion and corrosion resistance of aluminum coating were observed and determined. The results show that the aluminum coating on Q235 carbon steel deposited from AlCl3-NaCl-KCl inorganic molten salt is gray, smooth, uniform and with small needle-like or granular characters. The thickness of aluminum coating increases obviously with the increasing of current density and prolongation of electroplating time. At lower current density, (200) plane structure is reliable to be formed in the coating, but the aluminum coating is in ( 111 ) plane structure under higher current density. The adhesion of aluminum coating with the substrate decreases with the coating thickness, but greater than 30 N. The aluminum coating has a very higher corrosion resistance in 3.5% NaCl aqueous solution under the optimum current density of 3.3~4.0 A/dm^2 and electroplating time of 45~90 minutes.
出处 《兵器材料科学与工程》 CAS CSCD 北大核心 2005年第6期1-5,共5页 Ordnance Material Science and Engineering
基金 国家自然科学基金委员会与中国工程物理研究院NSAF联合基金资助项目(No.10376023)
关键词 熔盐电镀 组织结构 结合力 耐蚀性 electroplating by molten salt microstructure adhesion force corrosion resistance
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参考文献10

  • 1Li Qingfeng, Qiu Zhuxian. Applied electrochemistry of aluminum-production and applications [ M ]. Shenyang : Northeast University Press, 2003 : 3-6,240.
  • 2黄子勋.实用电镀技术[M].北京:化学工业出版社,2002..
  • 3Wolfgang F A, Donaldson S. Electroplating with aluminum [J ].Advanced Materials & Processes, 1996,149 (2) : 33-35.
  • 4Stafford G R, Grushko B, MeMiehael R D. The electrodeposition of Al-Mn ferromagnetic phase from molten salt electrolyte[J]. Journal of Alloy and Compound, 1993,200: 107-113.
  • 5Moffat T P. Electrodeposition of Al-Cr metallic glass[J]. J Electrochem Soc, 1994,141(9) :115-117.
  • 6Moffat T P. Electrodeposition of Ni1-xAlx in a chloroaluminate melt[J]. J Electrochem Soc, 1994,141 ( 11 ) :3059-3070.
  • 7Ueda M, Susukida D, Konda S, et al. Improvement of resistance of TiAl alloy against high temperature oxidation by electroplating in AlCl3-NaCl-KCl-CrCl2 molten salt [J]. Surface & Coating Technology, 2004,176(2) :202-208.
  • 8小浦延幸.丸冈恭一.バルス电解にょゐAlCl3-NaCl-KCl系熔融盐浴かちのアルミニアムのコニビュ-シミュし-ミョニ[J].金属表面技术,1987,38(10):471—477.
  • 9孙淑萍,尹彦冰,王兆文,李娟,高炳亮,邱竹贤.钢板熔盐电镀Al-Mn和Al-Ni合金镀层[J].东北大学学报(自然科学版),2000,21(1):66-69. 被引量:9
  • 10丁志敏,冯秋元,石子源,阎颖,金华.Q235钢表面熔盐电镀铝及其耐蚀性的研究[J].金属热处理,2004,29(7):41-43. 被引量:19

二级参考文献12

  • 1杜道斌.熔盐电解渗铝沉积过程及渗铝层性能研究[J].金属热处理,1993,18(10):16-21. 被引量:14
  • 2安捷洛夫,纯化学试剂,1989年
  • 3Nayak B,Misra M M.The electrodeposition of aluminum on brass from a molten aluminum chloride-sodium chloride bath[J].J.applied electrochemistry,1977,7(7):45-50.
  • 4Nayak B,Misra M M.The electrodeposition of aluminum on mild steel from a molten aluminum chloride-sodium chloride bath[J].J.applied electrochemistry,1979,9(9):699-706.
  • 5Grjotheim K,Matiasovsky'K.Some problems concerning aluminum electroplating in molten salts[J].Acta chemica scandinavica,1980,A34(9):666-670.
  • 6Li Qingfeng,Hjuler H A,Berg R W,et al.Electrochemical deposition of aluminum from NaCl-AlCl3 melts[J].J. Electrochem.soc.,1990,137(2):593-597.
  • 7邓志平 吴纯素.熔盐电解渗铝的研究[J].材料保护,1988,21(5):16-21.
  • 8Paucírova'M,Matiasovky'K.Electrolytic aluminum-plating in fused salts based on chlorides[J].Electrodeposition and Surface Treatment,1975,3(3):121-128.
  • 9Fellner P,Chrenkova-Paucírova'M,Matiasovsky'K.Electrolytic aluminum plating in salt mixtures based on AlCl3 Ⅰ:influence of the addition of Tetramethylammonium chloride[J].Surface Technology,1981,9(14):101-108.
  • 10Chrenkova-Paucírova'M,Fellner P,Silny'A,et al.Electrolytic aluminum plating in salt mixtures based on AlCl3 Ⅱ:influences of the pulsed current and of a copper underlayer[J].Surface Technology,1982,10(16):15-21.

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