摘要
详细介绍了焦磷酸盐镀铜工艺的前处理过程,讨论了镀液pH值、电流密度、空气搅拌及温度等工艺条件对镀层质量影响。通过控制适宜的工艺条件得到结晶细致光亮的镀层。同时由于镀液不含氰化物,镀液稳定性好,适宜于大批量工业生产,可广泛用作装饰性保护镀层的底层及工件防渗碳的过渡层。
The preceding disposing process of the copper pyrophosphate plating was introduced. The research results are focused on effects of the plating bath and the processing parameters on quality of the coating. The processing parameters include the plating bath pH value, current density, air agitation and bath temperature. The crystal and shining coating is gained by controlling the fitting processing parameters. Owing to containing free of cyanide the plating bath is steady and convenient to industrial production, moreover it is applied abroad in the bottom of protecting coating and the transition layer of preventing cementite.
出处
《表面技术》
EI
CAS
CSCD
2005年第6期64-65,共2页
Surface Technology
关键词
镀铜
PH值
电流密度
搅拌
温度
Copper plating
pH value
Current density
Agitation
Temperature
