摘要
介绍了高纯球形纳米SiO2在电子封装材料中的应用，高纯球形纳米SiO2的优越特性（高介电、高耐热、高耐湿、高填充量、低膨胀、低应力、低杂质、低摩擦系数等）和作用。并归纳和评价了高纯球形纳米SiO2的制备方法，认为以水玻璃为基本原料，采用溶胶-凝胶法能制备出可应用于电子元器件塑封料填料的高纯球形纳米SiO2。
In this paper, the application of high purity spherical nano-SiO2 to the electronic encapsulation is introduced. The character and function of high purity spherical nano-SiO2 are also introduced. High purity spherical nano-SiO2 is characterized with higher dielectric constants, higher heat resistance, higher wet resistance, higher fill quantity, lower dilatability, lower stress, lower impurity, lower friction modulus etc. The method of preparation of high purity spherical nano-SiO2 is concluded and evaluated. The high purity spherical nano-SiO2 prepared from water glass by sol-gel can be applied to the padding of high purity spherical nano-SiO2
出处
《材料导报》
EI
CAS
CSCD
北大核心
2005年第F11期150-151,159,共3页
Materials Reports
基金
四川省教育厅自然科学重点项目（2004A147）
关键词
高纯
球形
纳米SIO2
电子封装材料
high purity, spherical, nano-SiO2, materials of electronic encapsulation
