摘要
由于裸芯片的细小化,加之芯片封装体的“轻、小、短、薄”,封装体内部气泡易产生。根据芯片的SOP结构,通过改变树脂种类及树脂丸与模具料筒间的空隙量,分析和研究影响芯片封装体内部气泡产生的主要因素,为实际生产过程中提供科学依据。
Due to both the small-size of chips and the ‘light＇, ‘small＇, ‘short＇ and ‘thin＇ of packages, inner voids are often generated in packages. On the basis of SOP, the influence of the main factors on the inner void generation are analyzed by making experiments with different types ot resin and distances between Tablet and Pot, It can serve as a scientific reference for practical production.
出处
《传动技术》
2005年第4期24-26,共3页
Drive System Technique
