摘要
研究了(Ni W)纳米Si3N4复合镀层的共沉积条件,考察了电流密度、温度和时间等操作条件对镀层沉积速率和显微硬度的影响。结果表明,随着电流密度提高,复合镀层的沉积速率和硬度不断增加,但当电流密度达到16A dm2,镀层的硬度下降;合适的镀液温度为75°C左右,沉积时间约60min。
The co-deposition conditions of （Ni-W）-nano Si3N4 composite coatings are studied. The effects of current density, temperature, plating time, etc. on the deposition rate and micro-hardness of （Ni-W）-nano Si3N4 composite coatings are investigated. The results show that the deposition rate and micro-hardness of the composite coatings increase continuously with the increasing of current density, but the hardness will begin to fall down when current density reaches 16 A/dm^2 .The appropriate temperature is about 75℃ and deposition time about 60 min.
出处
《电镀与环保》
CAS
CSCD
2005年第4期1-3,共3页
Electroplating & Pollution Control
基金
安微省重点科研项目
合肥工业大学中青年创新群体基金(103037016)
