摘要
研究了Cu2+在氨基膦酸树脂上的吸附行为,其静态比饱和吸附容量为190.7 mg/g,用HCl溶液洗脱,洗脱率为98%以上.等温吸附服从Freundlich经验式,表观活化能为17.9 kJ/mol,表观速率常数为2.77×10-5s-1.树脂功能基与Cu2+的配位比约为1∶1,并探讨了其吸附机理.
The adsorption behavior of amino methylene phosphonic acid resin（APAR） for Cu（ Ⅱ ） was studied. Experimental results show that statically saturated adsorption capacity is 190.7 mg/g· resin; Cu （ Ⅱ ） adsorbed on APAR can be eluted with 2.0 mol/L HCl. The elution rate is 98 %. The sorption parameters of thermodynamic were gained. The adsorption behavior of APAR for Cu^2＋ obeys the Freundlich isotherm. The apparent activation energy is 17.9 kJ/mol. The apparent sorption rate constant is 2.77 × 10^-2 s^-1. The coordination molar ratio of the functional group of APAR to Cu（ Ⅱ ） is 1 ： 1. The adsorption mechanism of resin for Cu^2 ＋ is examined.
出处
《河北师范大学学报（自然科学版）》
CAS
北大核心
2006年第1期75-78,共4页
Journal of Hebei Normal University：Natural Science
基金
浙江省高校中青年学科带头人基金资助项目(99031)
浙江省教育厅科学研究基金资助项目(97211)
