摘要
通过分析塑料封装、陶瓷封装、玻璃封装和金属封装集成电路的材料成分,得出它们抵抗盐雾的腐蚀能力。根据市场的使用情况,选用塑封、陶封、玻封三种封装形式的集成电路按照6种不同的试验条件进行盐雾试验。文章通过对试验后的结果进行比较和分析,得出在正常盐雾腐蚀条件下, 它们性能受到影响的大小;在不同盐雾溶液和不同的温度条件下,陶瓷封装电路的性能也发生了变化。最后对塑料封装、陶瓷封装、玻璃封装电路的抗盐雾腐蚀能力进行了总结。
By analyzing the integrated circuit＇s material component of plastic package , ceramic packageglass package and metal package types drawing the anti-rusty ability for saltfog. Selecting three package types of IC , plastic package ceramic package and glass package making the saltfog test in six conditions at market＇ s using, drawing the performance influent in normal saltfog test condition by analyzing and compacting the result after testing ; the performance of ceramic package circuit changes in different saltfog liquor and different temperature.Finally summarizing the anti-saltfog rusty ability of plastic package ceramic package and glass package.
出处
《电子与封装》
2006年第2期24-27,共4页
Electronics & Packaging
