摘要
介绍了一种稳定性高、沉积速度较快的酸性化学镀Ｎｉ－Ｐ合金工艺．讨论了镀液组成及工艺条件对镀层沉积速度的影响，提出了化学镀Ｎｉ－Ｐ合金的最佳镀液组成和工艺条件．
A teChnique of electroless Ni-P alloy plating in acidic solution is intruduced, which is characterized by excellent stability of the plating solution and higher deposition rate. The effects of the composition of the plating salution and teChnological parameters on the deposition rate are discussed. In addition, the optimum solution composition and teChnological conditions are put forward.
出处
《沈阳工业大学学报》
CAS
1996年第2期49-54,共6页
Journal of Shenyang University of Technology
