摘要
针对国内外在硅微型压阻式压力传感器上的研究进展和产业化情况,从复合弹性元件的设计、芯片微加工工艺、芯片无应力封装和后期动静态标定等方面指出了其深入研究方向,以及产业化存在的问题和相应的对策。
The present research status and industrialization situation of ultraminiaturized pressure sensors is reviewed. The problems on design of the multilevel sensing structure, micro-machining process of chips, non-stress packaging of chips and the static and dynamic calibration are proposed. The methods for solving these problems are given. A broad prospect is anticipated with the support of research organization and development plans.
出处
《农业机械学报》
EI
CAS
CSCD
北大核心
2006年第3期157-159,共3页
Transactions of the Chinese Society for Agricultural Machinery
基金
浙江省科技攻关计划项目(项目编号:2005C31048)
镇江市产学研项目
江苏大学博士生创新基金项目
