摘要
研究了添加剂聚乙二醇(PEG)、氯离子(Cl-)和电流密度对Cu的电沉积过程的影响,着重探讨了制备(110)晶面全择优取向Cu镀层的电沉积条件及其形成机理.循环伏安(CV)结果表明,PEG阻化Cu的电沉积,Cl-加快Cu的电沉积速率.XRD实验结果表明,PEG和Cl-在一定浓度范围有利于(110)晶面择优取向;这两种不同特性的添加剂的协同作用可以制得(110)晶面全择优取向的较薄的Cu镀层;所制备的全择优Cu镀层较稳定.全择优取向Cu镀层形成的机理在于PEG和Cl-吸附过程联合起作用,在不同晶粒的不同晶面进行选择吸附,改变了晶面的生长速率及晶粒的快生长方向.
The electrodeposition conditions for the preparation of copper deposits with fully preferred orientation were investigated in detail. XRD results of copper electrodeposits showed that texture with （110） could be improved by either polyethylene glycol （PEG） or chloride ions. However, the presence of the both additives resulted in a fully preferred orientation of （110） plane because of the strong synergistic effect between PEG and Cl^-. The strong adsorption of PEG and Cl^- on different lattice planes of different grains was thought to be responsible for the preferential growth. The microstress of the copper deposits with fully preferred orientation was small which indicated that the deposits were stable. The influence of PEG and Cl^- on the copper electrodeposition had also been studied.
出处
《物理化学学报》
SCIE
CAS
CSCD
北大核心
2006年第3期378-382,共5页
Acta Physico-Chimica Sinica
基金
重庆市科技计划项目(CSTC
2005BB4042)
重庆大学校内基金资助
关键词
电沉积
Cu镀层
全择优取向
微观应力
Electrodeposition, Copper electrodeposits, Fully preferred orientation, Microstress
