摘要
以镀银玻璃球为导电填料制备室温硫化高导电有机硅密封剂,研究了密封剂的导电性能与形变的关系:在一定的导电填料加入量范围内,密封剂的导电性能随着拉伸形变而提高。
With the conductive filler of silver-coated hollow glass microspheres, RTV electrically conductive sealant was prepared. The relationship between electrical conductivity and deformation of the sealant was discussed. It was found that in a certain extent of the conductive filler amount the electrical conductivity was improved with increasing of the tensile deformation.
出处
《粘接》
CAS
2006年第2期26-27,44,共3页
Adhesion
关键词
导电
有机硅
密封剂
electrically conductive
silicone
sealant
