摘要
在无溶剂条件下利用烷氧基硅烷合成了有机硅低聚物,用聚酯多元醇对其进行了改性。采用红外光谱对低聚物和预聚体进行了表征。在此基础上研究了不同合成路线所构体系的粘接性能、力学性能,同时用TG对其耐热性进行了考察,结果表明路线一的耐热性较好,在680℃下失重为66．1％。
In the cases of non-solvent,oligomers of silicone were prepared by polycondensation of alkoxyl silicone and modified by polyester polyhydric alcohol.FT-IR was employed to characterize the structure of oligomers and prepolymer. Furthermore,the mechanical properties,adhesion properties of the products of different preparation routine were tested respectively. And the heat resistance was also characterized by TG. Finally,it was found that the products of the first method,which had the loss of weight 66.1% compared with original polymer at the temperature of 680℃,had the best heat resistance.
出处
《中国胶粘剂》
CAS
2006年第4期17-20,共4页
China Adhesives
关键词
有机硅
聚氨酯
改性
silicone
polyurethane
modified
