摘要
采用微加工工艺制备出一种聚合物微锥阵列。利用扫描电子显微镜(SEM)分析了在Si(100)衬底上通过微加工所获得的孔洞阵列和采用聚合物填充该孔洞所获得微锥阵列的形貌。研究表明:Si(100)衬底上倒金字塔孔洞阵列轮廓分明,内壁平滑;该聚合物微锥呈类圆锥的形貌,可用作制备场致发射微锥阵列的衬底材料。
A fabrication process： has：been developed to form a polymer microtip arrays using miemmachining. Scanning electronic microscope （SEM） was carried out to analyze the profile and quality of the arrays. The results indicate that the arrays of the converse pyramid holes with well-defined profile are formed in the Si substrate, and the surface is smooth and flat. The polymer microtip arrays are like-conical type. It＇s shown that the polymer microtip arrays may be used as a substrate for emission cathodes
出处
《武汉理工大学学报》
EI
CAS
CSCD
北大核心
2006年第4期41-43,共3页
Journal of Wuhan University of Technology
基金
中国博士后科学基金(2005037666)
关键词
微制造
聚合物
微锥阵列
micromaChining
polymer
microtip arrays
