摘要
在模拟和数字电路中,耦合微带线间的串扰会降低设备的性能。为了降低线间串扰,在攻击线两边各插入了一列用金属填充的、顶端用微带连接的接地孔。利用FDTD方法对该结构进行模拟,给出了接地孔的有效放置方法。
In analog and digital circuits, crosstalk between coupled microstrip lines can degrade the performance of equipment. To reduce the crosstalk two columns of metal filled via holes which are connected by microstrips on the top of via holes and grounded are inserted in two sides of aggressor line. The finite - difference time - domain （FDTD） method has been used tosimulate the structure and some guidelines for the proper placement of the via holes are proposed.
出处
《微波学报》
CSCD
北大核心
2006年第2期17-20,共4页
Journal of Microwaves
