摘要
采用磁控溅射法制备出HA／YSZ／Ti6Al4V生物复合材料，利用X-射线衍射仪（XRD）、扫描电镜（SEM）和能谱分析（EDXA）研究复合涂层的相组成、表面微观形貌和界面微观形貌，并用划痕仪测定复合涂层与基体的界面结合力．结果表明：溅射的复合涂层中主要含有HA、ZrO2和Y2O3物相，此外还有少量的TCP和CaO相；该复合涂层表面凹凸不平，呈现网状微孔结构，其孔隙直径约为0．5～2μm，孔隙面积占薄膜表面积的30％～40％．划痕试验表明，复合涂层与Ti6Al4V基体结合力约为80N．复合涂层拉伸试样横断面分析显示，在涂层与基体界面处无裂纹，界面处存在Ti6Al4V基体成分Ti与复合涂层成分Ca、P问互扩散的扩散层，该扩散层厚度为0．5～1．5μm，复合涂层界面的结合机制为机械齿合和扩散结合．
HA/YSZ/Ti6Al4V bio-composites have been developed by radio-frequency magnetron sputtering （RF-MS）. Phase constitution, surface morphology and interfacial characterization of the composite coating were investigated with X-ray diffraction （XRD）, scanning electronic microscopy （SEM） and energy dispersive X-ray analysis （EDXA）. The bond force of HA/YSZ/Ti6Al4V composite was measured by scratch testing. The results indicate that the main crystal phases of the coating are HA, ZrO2 and Y2O3. The surface morphology of the composite coating is coarse and uneven with the well-distributed concaves. The average diameter of these concaves is in the range of 0.5～1.5 μm, and the surface area of these concaves is about 30%～40%. The scratch test indicates that the interfacial bond force between HA/YSZ composite coating and the substrate Ti6Al4V alloy is about 80 N. The analysis on the interface of the composite coating in the tensile cross-section shows that there is no crack on the coating/substrate interface in HA/YSZ/Ti6Al4V bio-composites. The diffusion distribution of dements （such as Ti, Ca and P） in interfacial field indicates that there is a diffusion layer between composite coating and Ti6Al4V substrate. The thickness of the diffusion layer is about 0.5～1.5 μm. The interfacial bond mechanism of HA/YSZ/Ti6Al4V composite material fabricated by RF magnetron sputtering includes mechanical interlock and diffusion bond.
出处
《江苏大学学报（自然科学版）》
EI
CAS
北大核心
2006年第3期237-240,共4页
Journal of Jiangsu University：Natural Science Edition
基金
江苏省自然科学基金资助项目(BK2003051)
江苏省铝基复合材料工程技术研究中心研发项目(BM2003014)
关键词
HA/YSZ复合涂层
磁控溅射
制备
表面形貌
界面特性
机械齿合
扩散结合
HA/YSZ bio-composite coatings
radio-frequency magnetron sputtering
preparation
surface morphology
interfacial characterization
mechanical interlock
diffusion bond
