摘要
设计了一套硅片专用真空夹紧装置,包括夹紧装置和微型无油真空抽气泵。为减少硅片在夹紧过程中变形,夹紧装置采用了多吸口、回旋槽的平面型结构;根据所需夹紧力大小,设计了抽速为0.3L/s的微型真空泵,泵内无油避免了对硅片的污染;对间隙返流进行了计算并分析了对泵性能的影响。
A vacuum clamp equipment used for holding Si wafer is designed in this paper. The system is composed of a sucking device and a oil- free mini vacuum pump. The sucking device has a sucking- disk structure which contains multi- sucking mouths and gyral grooves in order to minimize the deformation of the wafer. A oil - free mini vacuum pump with pumping speed of 0.3 L/s is designed in order to provide proper holding force and keep the wafer from contaminating. The pumping speed is calculated while hack - flow of various clearances is taken into account.
出处
《机械与电子》
2006年第6期25-28,共4页
Machinery & Electronics
关键词
真空夹具
硅片
微型泵
vacuum clamp
Si wafer
minipump
