摘要
本文研究了在不同的固溶温度和相同的时效温度(530℃)条件下,固溶处理对Cu-Cr25触头材料的时效组织和性能的影响。结果表明:在相同的时效温度条件下,固溶温度越高,时效后CuCr25合金的硬度峰值越大;当固溶温度为920℃时,时效后CuCr25合金的电导率峰值最大;与固溶处理前相比,经过920℃固溶30 min+530℃时效2 h后,CuCr25合金的硬度提高了8.5%,电导率提高了14.6%。
Investigation was carried out on structure and properties of CuCr25 contact materials after solid solution treatment at different temperature aging at （530 12 ）. The results show that,the higher solid solution temperature, the higher hardness is, and the conductivity of the sample solid solution treated at 920 12 was the highest. Comparing with the samples without solid solution treatment, the conductivity of the sample increased by 14.6% and the hardness increased by 8.5 % treaded for solid solution at 920 12 and aged at 530 12 for 2 h.
出处
《粉末冶金工业》
CAS
北大核心
2006年第3期6-9,共4页
Powder Metallurgy Industry
关键词
CuCr25
固溶处理
硬度
电导率
CuCr25
solid solution treatment
hardness
conductivity
