摘要
文章主要介绍了封装过程中的几个重要工艺参数,分别探讨了不同的工艺条件对环氧塑封料成型工艺的影响,并介绍了封装过程中的工艺调整方向。同时介绍了在环氧塑封料的选择中必须考虑的几个重要因素,并论述了这几个因素对封装器件可靠性造成的影响。
In this paper, mainly introduce a few important technology parameters, and discuss the effection of the technology condition in the process of molding. At the same time we must think over a few factors of EMC, such as moisture absorption, stress and flowing, which can effect the reliability of device
出处
《电子与封装》
2006年第8期10-11,17,共3页
Electronics & Packaging
关键词
环氧塑封料
封装
内应力
流动性
epoxy molding compound （ EMC ）
encapsulation
stress
flowing
