摘要
报道了利用偶联技术封装光纤光栅压力传感器的新方案.通过采用特殊聚合物材料将光纤光栅封装于金属管中,并采用偶联材料分别与聚合物和光纤以化学键偶联的工艺,解决了由于有机弹性体聚合物的弹性模量(1.2×105N/m2)与光纤光栅的弹性模量(7×1010N/m2)相差很大,在压强较大时易导致光纤光栅与聚合物材料之间的撕裂滑脱问题,改善了光纤光栅压力响应特性.封装后的光纤光栅压力的线性测量范围为0.04MPa^0.6MPa,压力响应灵敏度为-4.48nm/MPa,与裸光栅压力响应灵敏度-0.003063nm/MPa相比,增敏了1463倍.利用实验中所使用光谱仪0.05nm的分辨率,压强测量准确度为±0.01MPa,线性度为0.9978.
A new approach for packed FBG（fiber Bragg grating） pressure sensor using chemical bonding technics between polymer and FBG was proposed and demonstrated. A kind of chemical bonding material was used to strengthen the bonding between fiber and polymer in order to improve the pressure response of FBG sensor. This technics resolved the problem of avulsion in high pressure due to the big difference elastic modulus between polymer and fiber. The experimental result indicated that, within 0.04 MPa～0. 6 MPa,the pressure response sensitivity was -4. 48 nm/MPa and the resolution pressure measurement was ＋0.01 MPa,which is 1463 times higher than that of the bare FBG.. The linearity of the temperature response curves is 0. 9978. Reflection spectrum showed a steady figure through repeated measurement.
出处
《光子学报》
EI
CAS
CSCD
北大核心
2006年第8期1199-1202,共4页
Acta Photonica Sinica
基金
国家"863"高技术发展计划(2002AA313150)
国家自然科学基金(69877025)
国家教育部科学技术重点项目(02190)
陕西省教育厅科学技术项目(02JK158)
西安石油大学青年创新科技基金资助
关键词
光纤光栅
聚合物封装
化学键偶联
压力传感器
Fiber Bragg grating
Polymer package
Chemical band combination
Pressure sensor
