摘要
集成电路的飞速发展使得从封装到电子设备的单位体积功耗和发热量不断增加。电子系统散热问题需要在设计阶段就通过热仿真予以充分考虑和预测。电子封装作为电子系统的最小组成部分,其简化模型的优劣直接影响电子系统热分析的速度和准确性。本文主要讨论单芯片封装稳态简化热模型的建立。先后介绍了从最简单的单热阻模型到目前广为关注的边界条件独立的DELPHI简化模型的结构。其中着重分析了两热阻模型和DELPHI模型的建模方法及过程。
The power dissipation and heat in a unit of electronic packages and equipments increase ceaselessly with the rapidly development of IC. The cooling of electronic systems needs to be care and predicts in design phase by thermal simulation. IC package is the smallest unit in electronic systems , compact thermal models of IC packages influence the speed and accuracy of thermal analysis directly. The paper presents mainly the generation of the steady-state compact thermal models of single chip packages, introduces the structure of models from single thermal resistance model to popular DELPHI model of 13121 at present and especially analyze two-resistance model and DELPHI model for the methods and process of model generated.
出处
《电子器件》
EI
CAS
2006年第3期672-675,679,共5页
Chinese Journal of Electron Devices
关键词
简化热模型
热阻
热分析
封装
compact thermal model
thermal resistance
thermal analysis
package
