期刊文献+
任意字段
题名或关键词
题名
关键词
文摘
作者
第一作者
机构
刊名
分类号
参考文献
作者简介
基金资助
栏目信息

BGA封装中含Bi,Ni的无铅焊球剪切强度研究 被引量：4

Shear Strength of Lead-Free Solder Ball Doped with Bi and Ni in BGA Packaging
下载PDF
导出
摘要 对Sn/3.5Ag/0.7Cu,Sn/3Ag/3Bi/0.5Cu和Sn/3Ag/3Bi/0.5Cu/0.1Ni三种BGA无铅焊球(0.76 mm)经不同热循环后,在FR-4基板上的剪切强度进行了测量.采用SEM和EDX对样品截面进行观察和元素分析.数据表明,Bi的掺入提高了焊料的润湿性及焊接强度,并减缓了IMC的生长速度;焊料中加入微量Ni可有效减小焊点下金属上Ni镀层的耗穿速度,抑制了焊球经热循环后焊接强度的下降. Shear strength of three kinds of BGA solder joints on FR-4 boerd with Cu pads is studied. The lead-free solders of Sn/3.5Ag/0.7Cu, Sn/3Ag/3Bi/0.5Cu and Sn/3Ag/3Bi/0.5CuA3.1Ni are used to make the BGA balls which are mounted on FR-4 board by solder reflow. After the thermal cycles, ball shear test was performed. In order to observe the microstructure and composition of IMC at interface, SEM and EDX are used to analyze of the samples. The experiment data show that Bi enhances the strength of solder joints by reducing the growth rate of IMC at the interface between solder and Cu pads; while Ni is effective to suppress the decreasing of the solder joints strength by depressing the consumption of the plated Ni on UBM.
作者 华彤 王珺 俞宏坤 肖斐
机构地区 复旦大学材料科学系
出处 《复旦学报（自然科学版）》 CAS CSCD 北大核心 2006年第4期489-494,共6页 Journal of Fudan University：Natural Science
基金 APEC科技产业合作基金资助项目
关键词 半导体工艺 无铅焊料 球栅阵列封装 封装可靠性 金属间化合物 semiconductor process lead-free solder BGA package reliability IMC
分类号 TN306 [电子电信—物理电子学]
  • 相关文献

参考文献12

  • 1Taguchi Toshihiko, Kato Rikiya, Akita Satoru. Lead Free Interracial Structures and Their Relationship to Au Plating (Including Accelerated Thermal Cycle Testing of Non-Leaden BGA Spheres) [C]//Electronic Components and Technology Conference. FL. Piscataway, NJ: Lake Buena Vista(IEEE), 2001.
  • 2Tsui Yat Kit, Lee S W. Ricky, Huang Xingjia. Experimental Investigation on the Degradation of BGA Solder Ball Shear Strength Due to Room Temperature Aging [C] // International Symposium on Electronic Materials and Packaging. Kaohsiung, Taiwan: IEEE, 2002.
  • 3和平,彭瑶玮,乌健波,孟宣华,何国伟.vf-BGA封装焊球热疲劳可靠性的研究[J].Journal of Semiconductors,2004,25(7):874-878. 被引量：6
  • 4Poon N M,Wu C M Lawrence, Lai Joseph K L, et al. Residual Shear Strength of Sn-Ag and Sn-Bi Lead-Free SMT Joints After Thermal Shock [J]. IEEE Transactions On Advanced Packaging ,2000,23(4):708-714.
  • 5Stam F A, Davitt E. Effects of thermomechanical cycling on lead and lead-free(SnPb and SnAgCu) surface mount solder joints [J]. Microelectronics Reliability ,2001,41 : 1815-1822.
  • 6Pang H L, Low T H, Xiong B S, et al. Thermal cycling aging effects on Sn-Ag-Cu raider joint microstructure,IMC and strength [J]. Thin Solid Films, 2004,462-463:370-375.
  • 7Yu Daquan, Duan Lilei, Zhao Jie, et al. The Formation and Growth of Intermetallic Compounds Between Sn-3.SAg Lead-Free Solder And Cu Substrate [C]//Wang Jiaji. ICEPT 2003. Shanghai, China. IEEE, 2003.
  • 8Qi Lin,Zhao Jie,Wang Xiumin, et al. The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process [C] ff International Conference on the Business of Electronic Product Reliability and Liability. Shanghai, China: IEEE, 2004.
  • 9Zhao Jie, Qi Lin, Wang Xiumin, et al. Influence of Bi on microstructures evolution and mechanical properties in Sn-Ag-Cu lead-free solder [J]. Journal of Alloys and Compounds, 2004,375 : 196-201.
  • 10Wu C M. Lawrence, Huang Mingliang. Microstructural Evolution of Lead-free Sn-Bi-Ag-Cu SMT Joints during Aging [J]. IEEE Transaction on Advanced Packaging, 2005,28 : 128-133.

二级参考文献12

  • 1Fan S H,Chan Y C.Aging studies of PBGA solder j oints reflowed at different conveyor speeds.IEEE Trans Advanced Packaging,2001, 24(4):486
  • 2Lau J H.Solder joint reliability of BGA,CSP,flip chip,andfine pitch SMT assemblies.New York:McGraw-Hill,1997
  • 3Pao Y H.An experimental and finite element study of thermal fatigue fracture of PbSn solder joints.ASME Trans J Electron Package,1993,115: 1
  • 4Cai Xia,Chen Liu,Zhang Qun,et al.Thermal fatigue failure a nalysis of SnPb solder joint in flip-chip assemblies.Chinese Journal of Semicon ductors,2002,23(6):660(in Chinese)[彩霞,陈柳,张群,等.倒扣芯片连接焊点的热疲劳失效
  • 5Pang J H L,Chong D Y R.Thermal cycling analysis of flip-ch ip solder joint reliability.IEEE Trans Comp Packag,2001,24(4):705
  • 6Pratt R E,Stromswold E I.Effect of solid-state intermetall ic growth on the frature toughness of Cu/63Sn-37Pb solder joints.IEEE Trans Com p Packag Manufact Technol A,1995,19:134
  • 7Pang H L J,Tan K H, Shi X Q,et al.Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cyc ling aging.Mater Sci Eng A,2001,307:42
  • 8So A C K,Chan Y C.Reliability of studies of surface mount solder joints -effect of Cu-Sn intermetallic compounds.IEEE Trans Comp Package Manufact Tec hnol B,1996,19:661
  • 9Zhong C H,Yi S.Missing solder ball failure mechanisms in plastic ball gr id array packages.IEEE ECTC,2000
  • 10Lee W W,Nguyen L T.Solder joint fatigue models:review and applicability to chip scale packages.Microelectronics Reliability,2000,40:231

共引文献5

同被引文献25

  • 1王薇,王中光,冼爱平,尚建库.CBGA结构热循环条件下无铅焊点的显微组织和断裂[J].金属学报,2006,42(6):647-652. 被引量：7
  • 2薛松柏,韩宗杰,王慧,王俭辛.矩形片状元件无铅焊点断裂机制[J].焊接学报,2006,27(8):23-26. 被引量：4
  • 3薛松柏,吴玉秀,崔国平,张玲.热循环对QFP焊点强度及其微观组织影响规律的数值模拟[J].焊接学报,2006,27(11):1-4. 被引量：15
  • 4[2]Xue Songbai,Wang Hui,Hu Yongfang.Effects of thermal cycling on soldering joints' shear strength of laminar ceramic resistor[J].Transactions of Nonferrous Metals Society of China,2005,15(S3):305-310.
  • 5[5]Wang C H,Chen S W.Sn-0.7wt.% Cu /Ni interfacial reactions at 250℃[J].Acta Materialia,2006,54(1):247-253.
  • 6[6]Nishikawa H,Piao J Y,Takemoto T.Microstructure of interface between Sn-Cu solder with Ni and Cu plate[J].Journal of the Japan Institute of Metals,2006,70(5):427-433.
  • 7[7]Wu C M L,Yu D Q,Law C M T,et al.Properties of lead-free solder alloys with rare earth element additions[J].Materials Science and Engineering:R,2004,44(1):1-44.
  • 8[8]Qi Y,Lam R,Ghorbani H R,et al.Temperature profile effects in accelerated thermal cycling of SnPb and Pb-frees solder joints[J].Microelectronics Reliability,2006,46(2-4):574-588.
  • 9LI GY,CHEN B L.Formation and growth kinetics of interfacial intermetallics in Pb-free solder joint[J].IEEE Transactions on Components and Packaging Technologies,2003,26(3):651-658.
  • 10PANG H L J,TANK H,SHI X Q,et al.Microstructure and intermetallic growth effects on shear and fatigue of solder joints subjected to thermal cycling aging[J].Mater Sci Eng A,2001,307(1):42-50.

引证文献4

二级引证文献15

复旦学报（自然科学版）
2006年 第4期

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部