摘要
通过对原有的H2SO4-HCl腐蚀体系的深入研究,提出了新的发孔与扩孔工艺条件。适当地提高发孔液的浓度和温度,能提高初始蚀孔密度及分布度的均匀性;降低扩孔液的浓度,能有效地降低铝箔的表面溶解度,减少串孔现象的发生,从而提高腐蚀的比容及机械强度。脉冲精致扩孔腐蚀理论的提出,为进一步提高阳极箔比容的研究提供了更多的选择。
The primary H2SO4-HCI etching system is extensively studied, and a new technical condition about creating holes and enlarging holes is presented. Appropriately increasing the consistency and temperature of the solution used to create holes can improve the uniformity of the primary density and distribution.. To lower the concentration of the solution used to enlarge holes can effectively lower the solubility on the surface of A1-foil and reduce the cuniculi of hole, resulting in the improvement of capacitance and mechanical intensity of etched foil. Using pulse to enlarge holes can offer more choices for improving the capacitance of anode foil.
出处
《电子产品可靠性与环境试验》
2006年第5期1-6,共6页
Electronic Product Reliability and Environmental Testing
关键词
电解电容器
腐蚀工艺
脉冲扩孔
比容
aluminum electrolytic capacitors
etching process
pulse enlarge holes
capacitance
