摘要
A novel dual gate oxide （DGO） process is proposed to improve the performance of high voltage CMOS （HVCMOS） devices and the compatibility between thick gate oxide devices and thin gate oxide devices. An extra sidewall is added in this DGO process to round off the step formed after etching the thick gate oxide and poly-silicon. The breakdown voltages of high voltage nMOS （HVnMOS） and high voltage pMOS （HVpMOS） are 168 and - 158V, respectively. Excellent performances are realized for both HVnMOS and HVpMOS devices. Experimental results demonstrate that the HVCMOS devices work safely at an operation voltage of 100V.
提出了一种新的双栅氧(dual gate oxide,DGO)工艺,有效提高了薄栅氧器件与厚栅氧器件的工艺兼容性,同时提高了高低压器件性能的稳定性.在中国科学院微电子研究所0.8μm n阱标准CMOS工艺基础上设计出高低压兼容的100V高压工艺流程,并流片成功.实验结果表明,高压n管和高压p管的关态击穿电压分别为168和-158V,可以在100V高压下安全工作.
基金
国家重点基础研究发展计划资助项目(批准号:2003CB314705)~~
