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Cu-Ni-Si合金时效的正交试验研究 被引量:2

Research on Aging of Cu-Ni-Si Alloy With Orthogomal Test
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摘要 采用正交试验对Cu-3.2Ni-0.75Si-0.3Zn合金的时效工艺进行了研究。结果发现,各因素对合金导电率和显微硬度影响程度的主次顺序分别为:时效温度>合金状态>时效后冷变形量>时效时间和时效温度>冷变形量>合金状态>时效时间。在保证合金性能不降低的情况下,该合金热轧板材经60%冷变形后,可直接进行时效而省去固溶处理。合金经最佳工艺时效和60%冷变形后,导电率和显微硬度分别可达41.96%I-ACS和263.4Hv。 Influence of technological factors on the aging of Cu-3.2Ni-0.75Si-0.3Zn alloy was investigated with orthogonal test. It was founded that the sequence affecting electric conductivity and micro-hardness is as follows, aging ternperature〉alloy' s state〉 degree of cold deformation〉aging time and aging temperature〉 degree of cold deformation〉 alloy' s state 〉 aging time. The alloy can be direct aged after 60% cold deformation without solution and the properties will not be deteriorated. Mter proper aging and 60 % cold deformation, the electric conductivity of the alloy reaches 41.96 % IACS and the micro-hardness reaches 263.4Hr.
出处 《材料开发与应用》 CAS 2006年第6期4-7,共4页 Development and Application of Materials
基金 国家自然科学基金资助项目(50071026) 河南省重大科技攻关项目(0122021300)
关键词 CU-NI-SI合金 正交试验 时效 显微硬度 导电率 Cu-Ni-Si alloy Normal experiment Aging Micro- hardness Electric conductivity
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共引文献105

同被引文献10

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