期刊文献+

芯片强化散热研究新领域——低熔点液体金属散热技术的提出与发展 被引量:18

New Frontier in Enhanced Chip Cooling Its Proposal and Development of Liquid Cooling Method Using Low-melting-point Metal as Coolant
下载PDF
导出
摘要 近年来,高集成度计算机芯片、光电器件等引发的热障问题,已成为制约其持续发展的技术瓶颈之一。围绕这一紧迫现实需求,提出将室温下呈液体状态的低熔点金属或其合金作为冷却流动工质,以发展先进芯片散热器的技术观念,并在相应的理论分析、试验研究及实际器件的研制等方面取得了进展。随后,国外也启动了类似研究,相应进展立即在产业界及学术界产生重要反响。种种态势表明,液体金属芯片散热技术已成为计算机热管理领域内极具探索价值的新前沿。由于液体金属热导率远高于常规流体,因而在传热效果上可望显著优于传统的液冷方法,该方法的建立为发展高性能芯片冷却技术开辟了一条全新的途径。回顾新方法提出的过程,归纳出其中有待解决的一些重要科学问题,并对其应用前景进行展望。 In recent years, the "thermal barrier" encountered in a highly integrated computer or optoelectronic chip has become a bottle neck to prevent its further development. To solve this urgent problem, we proposed for the first time the technical approach of using metal with low melting point or its alloy as the cooling fluid, so as to develop advanced chip cooling device. A series of progress of theoretical, experimental investigations as well as fabrication of practical devices were made. At a little later time, similar efforts were also made abroad, which immediately received intense attentions from both industry and academic fields. Various evidences indicate that, the liquid metal based chip cooling is becoming a new frontier in the thermal management of computer system. With much larger heat conductivity than that of ordinary fluids, the liquid metal would have superior heat transfer capacity over traditional coolant, which may lead to a brand new way for making advanced chip cooling device. In this paper the progress of the new method is reviewed, and the important scientific issues thus raised are summarized. Prospects for the application of the liquid metal cooling method is also discussed.
作者 刘静 周一欣
出处 《电子机械工程》 2006年第6期9-12,25,共5页 Electro-Mechanical Engineering
基金 国家自然科学基金(批准号:50576103 50325622)
关键词 芯片冷却 计算机热管理 低熔点液态金属 强化换热 光电系统/纳电子 chip cooling computer thermal management low-melting-point liquid metal enhanced heat transfer optoelectronic system micro/nano electronics
  • 相关文献

参考文献10

  • 1李腾,刘静.芯片冷却技术的最新研究进展及其评价[J].制冷学报,2004,25(3):22-32. 被引量:66
  • 2李腾,刘静.芯片冷却技术中的微/纳米材料与结构的研究进展[J].微纳电子技术,2004,41(8):21-27. 被引量:10
  • 3刘静,周一欣.以低熔点金属或其合金作流动工质的芯片散热用散热装置[P].中国专利,02131419.5
  • 4李腾,吕永钢,刘静,周一欣.基于低熔点金属及其合金的计算机芯片散热方法[C].中国工程热物理学会2004年传热传质学会议,吉林,2004:1115-1118
  • 5J Liu, Y X Zhou, Y G Lv, and T Li. Liquid metal based miniaturized chip - cooling device driven by electromagnetic pump[ C]. 2005 ASME International Mechanical Engineering Congress & Exposition, 2005:5 - 11
  • 6T Li, Y G Lv, J Liu, and Y X Zhou. A powerful way of cooling computer chip using liquid metal as the cooling fluid[ M ]. Forschung im Ingenieurwesen Engineering Research, Published online :2006:8 - 26
  • 7Z S Deng, J Liu. Numerical evaluation on the heat dissipation capability of liquid metal based chip cooling device[ C ]. 12005 ASME International Mechanical Engineering Congress & Exposition :2005:5 - 11
  • 8J Liu. Development of new generation miniaturized chipcooling device using metal with low melting point or its alloy as the cooling fluid [ C ]. Proceedings of the International Conference on Micro Energy Systems, 2005:89 -97
  • 9G Uttam, C M Andrew. Cooling of electronics by electrically conducting fluids [ P]. United States Patent, 6,708,501,2004
  • 10安德鲁·卡尔·米勒,乌坦·高沙尔.散热装置及其热分散器[P].中国专利200410002780.X

二级参考文献91

  • 1[17]VISWANNATH R,NAIR R,WAKHARKAR V,et al.Thermal performance challenges from silicon to systems [ J] . Intel Technology Journal, 2000, 3: 1-16.
  • 2[19]CHEN C H, ZENG S, MIKKELSEN J C, et al. Microfabricated electrokinetic micropump [J] . Abstracts of Papers of The American Chemical Society. 2000. 431.
  • 3[22]GHOSHAL U, GHOSHAL S, MCDOWELL C, et al. Enhanced thermoelectric cooling at cold junction interfaces [J] .Appl Phys Lett, 2002, 80: 3006-3008.
  • 4[23]MINER A, MAJUMDAR A, GHOSHAL U. Thermoelectromechanical refrigeration based on transient thermoelectric effects[J]. Appl Phys Lett, 1999, 75: 1176-1178.
  • 5[24]MA H B, PETERSON G P. The influence of the thermal conductivity on the heat transfer performance in a heat sink[J]. Journal of Electronic Packaging, 2002, 124: 164-169.
  • 6[25]TASAKA M, SHINOHARA K, HAYASHI C, et al. Cooling performance of heat sinks with corrugated-fins [A] . Inter Socity Conference on Thermal Phenomena [C] . 1998. 104-111.
  • 7[26]LI C, WIRTZ R A. Development of a high performance heat sink based on screen-fin technology [A] . 19th IEEE SEMITHERM [C] . 53-60.
  • 8[27]LIM G, YUN H, LEE J H, et al. United States Patent Application Publication pub [P] . US: 2002/0056543 A1, 2002-05-16.
  • 9[28]GO J S, KIM S J, LIM G, et al. Heat transfer enhancement using flow-induced vibration of a micro fin array [J] . Sensors and Actuators A, 2001, 90: 232-239.
  • 10[29]WU S F, YANG S J. A new model for heat transfer of fins swinging back and forth in a flow [J] . International Journal of Heat and Mass Transfer, 2001, 44: 1687-1697.

共引文献72

同被引文献130

引证文献18

二级引证文献124

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部