摘要
系统集成芯片(SoC)是21世纪集成电路的发展方向,它以IP核复用技术、超深亚微米工艺技术和软硬件协同设计技术为支撑,是系统集成和微电子设计领域的一场革命。该文阐述了SoC的设计与验证、IP的开发与复用以及工程化SoC所面临的超深亚微米下的物理综合、软硬件协同设计、低功耗设计、可测性设计和可重用技术等方面的挑战。
As a development direction of IC in 21^st century, SoC, based on IP core reusing technique, very deep sub-micron technique, co-design of software and hardware technique, is a revolution in system integration and mieroelectronic design. The challenges in design and verification of SoC, development and reuse of IP core and physical synthesis in very deep sub-micron, co-design of software and hardware, low pawer design, design for test and reusability technique of engineering oriented SoC are described.
出处
《计算机工程》
EI
CAS
CSCD
北大核心
2006年第23期229-231,共3页
Computer Engineering
