摘要
金锗合金有着低的接触电阻及与衬底粘附性好等特点,主要用于M/S(金属/半导体)中以形成欧姆接触;同时,由于其良好的润湿性、导电性和导热性及较低的封接温度和热膨胀系数,在电子封装中也得到广泛应用。
Au-Ge alloy has low contact resistance, and good stickiness with substrate. It is used mainly in metal/semiconductor （M/S） system to. form ohmic contact. And, because of good wettability, electrical and thermal-conductivity, low sealing package temperature and coefficient of thermal expansion, so it is widely used in electron package.
出处
《贵金属》
CAS
CSCD
2007年第1期63-66,共4页
Precious Metals
