摘要
基于串行单斜率积分的原理,提出了一种新型的像素级红外焦平面片上8位模数转换电路。设计了一个8×8像素阵列组成的完整读出电路芯片,并进行了版图设计和电路仿真。每个单元像素电路采用直接注入方式输入,输出与输入电流成正比的数字脉冲信号,经每列单元共享的计数器计数输出。采用独特的数字电路列共享结构,电荷注入补偿等技术,具有结构简单、面积小等特点。仿真及测试结果表明,该芯片能较好地完成红外焦平面信号读出及模数转换功能,单元面积80μm×80μm,单元功耗50μW,量化等级达到8位,芯片实测量化误差小于4 LSB,帧速可达460 f/s。
A new type of pixel-level on-chip analog-to-digital conversion circuit for infrared focal plane array（IRFPA） has been proposed based on serial single-slope integration. An 8 × 8 pixel array readout, circuit chip has been designed. The layout design and circuit simulation of the chip are also been completed. In each pixel, the current signal is inputted through a data input （DI） injection circuit and outputted as a series of digital pulses proportional to magnitude of input current. Then these digital pulses are counted by the counter which shared by each column pixel. With the unique sharing structure and compensation technique of injected charge, this circuit shows many advantages, including simple structure and small area. Simulation result shows that this chip can realize signal readout and A/D conversion of IRFPA. Each pixel has an area of 80μm×80μm and average power consumption of 50μW. Simulation and test results show that the quantized resolution of this circuit is 8 bit and quantized error is less than 4 LSB. Frame rate reaches up to 460 f/s.
出处
《半导体光电》
CAS
CSCD
北大核心
2006年第6期668-671,共4页
Semiconductor Optoelectronics
关键词
焦平面
模数转换
单斜率
像素级
FPA
analog-to-digital conversion
single-slope
pixel-level
