摘要
从欧姆接触形成的机理出发,介绍了在AlGaN/GaN HEMT中实现源和漏区欧姆接触的各种方法,如表面处理技术、金属化系统和重掺杂技术等。回顾了近年来这些方法的研究进展。
Based on the mechanism of ohmic contacts, various kinds of methods for realizing ohmic contacts in AlGaN/GaN HEMTs were introduced, such as surface treatment, metallization scheme, heavily doped technology and so on. The resent progress and development of these methods were reviewed.
出处
《半导体技术》
CAS
CSCD
北大核心
2007年第1期6-11,共6页
Semiconductor Technology
基金
国家重点实验室基金项目(0502060C06)
国防基础科研项目(A1120060954)
国家重大基础研究项目(51327030201
51327030402)