摘要
主要对集成电路封装用环氧树脂模塑料的性能影响因素进行了研究,采用硅微粉偶联剂处理、高速混合、双辊开炼、冷却粉碎、模压工艺路线,以高纯度邻甲酚醛环氧树脂为基体树脂,以硅微粉为填充剂,用正交实验法对集成电路封装用模塑料进行了配方优化,经过实验分析,获得了较优配方。考察了几个因素对环氧树脂模塑料性能的影响。结果表明,所制备的环氧模塑料性能达到了集成电路封装用模塑料的性能要求。端羧基液体丁腈橡胶对环氧树脂具有明显的增韧作用。
The formulation and the process of the epoxy molding compound （EMC） for electronic packaging were studied. By means of the surface treatment by silane coupling agent, high speed premixing, twin relier mixing, cooled pulverizing and mould pressing, and taking ortho-eresol novolae epoxy （ECN） as matrix resin, silica powder as the filler, the formulation of the EMC for electronic packaging were optimized by means of orthogonal test, and the optimum formulation of EMC was obtained, and some parameters affecting the properties of the EMC were stud- ied.The results showed the properties of the prepared EMC could meet the demands for the property of the EMC, and carboxyl-end butadiene- acrylonitrile copolymer （CTBN） had great toughening effect on EMC.
出处
《塑料工业》
CAS
CSCD
北大核心
2007年第2期5-9,16,共6页
China Plastics Industry
基金
北京市自然科学基金资助项目(2072007)
关键词
环氧模塑料
电子封装
正交实验
Epoxy Molding Compound
Electronic Packaging
Orthogonal Test
