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Reliability aspects of electronics packaging technology using anisotropic conductive adhesives 被引量:1

Reliability aspects of electronics packaging technology using anisotropic conductive adhesives
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摘要 Anisotropic conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last few years. It is time to make a summary of what has been done in this field. The present paper reviews the technology development, especially from the reliability point of view. It is pointed out that anisotropic conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for anisotropic conductive adhesives in various applications. Anisotropic conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last few years. It is time to make a summary of what has been done in this field. The present paper reviews the technology development, especially from the reliability point of view. It is pointed out that anisotropic conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for anisotropic conductive adhesives in various applications.
出处 《Journal of Shanghai University(English Edition)》 CAS 2007年第1期1-16,共16页 上海大学学报(英文版)
关键词 electronics packaging anisotropic conductive adhesives RELIABILITY electronics packaging, anisotropic conductive adhesives, reliability
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