摘要
随着电子设备中电子元器件功率不断变大,而物理尺寸却不断变小,热流密度不断增加,导致电子器件工作时温度过高,势必会影响电子元器件的性能,这就要求对其进行有效的温度控制.相变温控因其装置结构紧凑、性能可靠、经济节能等优点近年来被广泛地应用在各类电子设备的温控上.本文针对电子设备的散热温控问题,综述了国内外相变温控在电子设备上的应用研究进展,并提出了这一领域未来的研究方向.
With the rapid increase of power of electronic components in electronic devices, while their physical sizes become smaller, their power density is significantly increased, which leads to higher temperature affecting their performance, more effective temperature control is required. Phase change thermal control has been widdy used in thermal control of electronic devices recently because it has compact structure, reliable performance and energy-saving property. This paper summarizes the applications of phase change thermal control in dectronic devices to the question of heat dissipation of dectronic devices, finally points out the direction of future research in this field.
出处
《电子器件》
CAS
2007年第1期344-348,共5页
Chinese Journal of Electron Devices
关键词
热管理
相变温控
电子设备
相变材料
thermal management
phase change thermal control
electronic equipment
phase change material
