摘要
通过化学镀的方法在镍粉表面包覆金属银。探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。结果表明,随着镀液中pH、cHCHO/cCu2+、mCu/mAg比值的增加,银包镍粉的电阻率均呈现先下降后增加的趋势。当镀液中pH=12,cHCHO/cCu2+=3,mCu/mAg=0.3时,所得的银包镍粉电阻率最低。扫描电镜图和能谱图显示,银包镍粉镀层表面平滑、均匀,复合粉体的含银量达到了30%(质量分数)。
The silver coated nickel powder was prepared by electroless copper plating. The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed. Results show that the resistivity of silver coated nickel powder is decreased first and then increased with increasing pH value, ratio of CHCHO/CCu^2＋ and mcu/mAg in the bath. The resistivity of silver coated nickel powder is the lowest at pH = 12, CHCHO/CCi^2＋ = 3, mCu/mAg = 0.3. SEM photos and EDS diagram show that the surface of the silver coated powder is smooth and even. The silver content in the composite powder is up to 30% （mass fraction）.
出处
《电镀与涂饰》
CAS
CSCD
2007年第3期17-19,共3页
Electroplating & Finishing
关键词
银包镍粉
复合粉体
化学镀
镀铜
镀银
电阻率
silver coated nickel powder
composite powder
electroless plating
copper plating
silver plating
resistivity
