摘要
本文采用三维有限差分的方法对影响散热的几个因素，如冷却条件、封装结构及功率分布等进行分析，以便对实际设计及使用中的散热问题有所帮助．
Abstract In this paper, several factors (include air velocity, power spot distribution and heat spreader size)that influence the junctiontemperature are dicussed, wih aid of a 3-dimensional finite differential method and an analysis of a typical package thermal resistance network.
关键词
集成电路
高组装密度器件
散热分析
Cooling
Heat transfer
Integrated circuit layout
Mathematical models
