摘要
针对一个基于硅基板的MCM电路建立了两种不同芯片布局的有限元热分析模型。利用热场分析理论并采用AutoTHERM软件,对两种布局条件下的温度场分布进行了仿真与分析。结果表明:不同的芯片布局导致温度场分布不同,两种方案的最高温度之差为6℃;将功率器件直接置于框架角落,而其余器件分布在硅基板上,可有效地减弱热耦合现象并使最高温度显著降低。该MCM在25℃下工作1h,温升小于10℃,满足使用要求。
Two finite element thermal models for MCM with silicon substrate were built. With the help of AutoTHERM software, the thermal fields of the two models were simulated and analyzed. The results show that the temperature distributions of the two models are affected by their different placements. The thermal coupling effect is reduced evidently when two power dies are placed directly on lead-frame comers and the others logic dies on the silicon substrate. After working over one hour under the environment of 25 ℃, the temperature of MCM arranged correctly is increased less than 10℃ which met the demand.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第4期62-64,共3页
Electronic Components And Materials
基金
江苏省高技术资助项目(BG2005022)
新型显示技术及应用集成教育部重点实验室开放课题资助项目(NO.P200504)
江苏省专用集成电路设计重点实验室开放课题资助项目(JSICK0604)
南通大学自然科学基金资助项目(05Z115)
关键词
电子技术
多芯片组件模块
热建模
热分析
有限元
electron technology
MCM
thermal modeling
thermal analysis
finite element
