摘要
针对金属互连系统上的热点将对集成电路芯片的性能和可靠性产生重大的影响,详细讨论了ULSI金属互连系统上的热点位置和温度分布模型,并通过该模型比较了不同通孔直径和高度情况下,金属互连系统上的热点位置和温度的差别。结果表明,通孔直径和高度对金属互连系统上的热点有重大的影响。
Hot spot is one of the most important factors to the performance and reliability of ULSIo An analytical thermal model for estimating the positions and temperatures of hot spot in interconnect and via systems is presented, and comparing the positions and temperatures of hot spots in different via diameters and via heights in the paper. It has been shown that via diameter and via height have important effects on the hot spot of interconnect and via systems.
出处
《微电子学与计算机》
CSCD
北大核心
2007年第4期144-147,共4页
Microelectronics & Computer
基金
国家自然科学基金项目(60076013)
关键词
热点
通孔直径
通孔高度
hot spot, via diameter
via height
