摘要
环保要求和微电子器件的高度集成化驱动了高性能无铅焊料的研究和开发,近年来,Sn-Zn基无铅钎料因熔点与SnPb相近,成本低廉和机械性能优良等优点而备受关注,但是焊料的差异和焊接工艺参数的调整给焊点的可靠性带来了新的影响。本文总结了SnZn系焊料的主要失效模式,重点围绕热疲劳与机械疲劳、焊料和基体界面金属间化合物形成致裂、腐蚀等问题,阐述了SnZn系无铅焊料的可靠性,并指出提高其连接可靠性的几个途径。
At present, the electronic packaging industry is actively searching for lead-free solders due to environmental concern of Ph-hased solders. In particular, Sn-Zn eutectic alloy has been much expected as a candidate for a Pb-free solder material because of its low melting temperature near to SnPb , low cost and excellent mechanical properties. However, Some common reliability problems in electronic solders and new reliability problems are caused by lead-free solders. In this paper, the dominate failure modes （and the effect factors of reliabity are summarized, several ways to adcance the reliability of lead-free solder joint are put forward.
出处
《金属功能材料》
CAS
2007年第2期41-45,共5页
Metallic Functional Materials
